NXP Semiconductors N.V. (NASDAQ: NXPI) enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is driving innovation in the secure connected vehicle, end-to-end security & privacy and smart connected solutions markets. Built on more than 60 years of combined experience and expertise, the company has 45,000 employees in more than 35 countries. The Technology & Operation Group is NXP’s central R&D Group, providing technology innovation and manufacture for the whole company.
Master – CNY 240/day
Phd – CNY 360/day
The Technology & Operation Group of NXP is hiring intern to the Characterization Labs of SPICE modeling team in Beijing and Tianjin.
The main part of the job includes On-wafer device characterization, which includes DC, CV, 1/f noise, s-parameters, pulse IV, etc.
The devices include but are not limited to MOS, LDMOS, BJT, diode, resistor, capacitor, etc.
The ideal candidate will have the following qualifications:
- oMaster Degree in Electronic Engineering or related field.
- oGood background in semiconductor device physics or EM.
- oKnowledge and experience with DC, HV, and RF device characterization techniques is a big plus.